Greatly improve the mechanical strength of the material on the basis of maintaining the insulation and wave transmittance of PEEK resin.
The mechanical strength of the material is improved while the insulation and wave transmittance of PEEK resin are maintained.
Material Properties | Test Method | Conditions | Units | 770G |
Mechanical Data | ||||
Tensile Strength | ISO 527 | B reak,23℃ | MPa | - |
Y ield,23℃ | MPa | 100 | ||
Tensile Elogation | ISO 527 | Break,23℃ | % | 45 |
Flexural Strength | ISO 178 | Break,23℃ | MPa | - |
Y ield,23℃ | MPa | 165 | ||
Fleoural Modulus | ISO 178 | 23℃ | Gpa | 4.1 |
Compressive Strength | ISO 604 | 23℃ | MPa | 125 |
Charpy Impact Strength | ISO 179/leA | Notched | kJm-2 | 7 |
ISO 179/IU | Unnotched | kJm-2 | - | |
Izod Impact Strength | ISO 180/A | Notched | kJm-2 | 7.5 |
ISO 180/U | Unnotched | kJm-2 | - | |
Mould Shrinkage | ISO 294-4 | Along flow | % | 1 |
Across flow | % | 1.3 | ||
Thermal Data | ||||
Melting Point | ISO 11357 | ℃ | 343 | |
Glass Tansition (Tg) | ISO 11357 | Onset | ℃ | 143 |
Special Heat Capacity | DSC | 23℃ | kj kg-1℃-1 | 2.2 |
Coefficient of Thermal Expansion | ISO 11359 | Along flow below Tg | ppm K-1 | 45 |
Along flow above Tg | ppm K-1 | 120 | ||
Heat Deflecion Temperature | ISO 75A-f | 1.8Mpa | ℃ | 152 |
Thermal Conductivity | ASTM C177 | 23℃ | W m-1K-1 | 0.29 |
Flow | ||||
MeltIndex | ISO 1133 | 380℃,5kg | g10min-1 | 10 |
Miscellaneous | ||||
Density | ISO 1186 | Crystalline | gcm-3 | 1.3 |
Amorphous | gcm-3 | 1.26 | ||
Shore D Hardness | ISO 868 | 23℃ | 85 | |
Water Absorption(3.2mm thick Tensile Bar) | ISO 62-1 | 24h,23℃ | % | 0.07 |
by immersion | Equilib riu m,23℃ | % | 0.4 | |
Electrical Data | ||||
Dielectric Strength | IEC 60243-1 | 2mm | kV mm-1 | 23 |
Comparative Tracking Index | IEC 60112 | V | 150 | |
Dielectric Constant | IEC 60250 | 23℃,1kHz | 3.1 | |
23℃,50kHz | 3 | |||
Loss Tangent | IEC 60250 | 23℃,1MHz | 0.004 | |
Volume Resistivity | IEC 60093 | 23℃,1V | Ω cm | 10 16 |
275℃ | Ω cm | 10 9 |
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