English
×
Search
In the context of the global integrated circuit manufacturing capacity being continuously tight, investment in related fields of integrated circuits in China has significantly increased over the past two years.
Under such circumstances, the substantial growth in investment in semiconductor device equipment, electronic components, and special electronic materials manufacturing has also driven the demand for PEEK materials.
In the semiconductor industry, CMP retaining rings and wafer carriers made of PEEK materials are receiving increasing attention and have been widely used.
Advantages of PEEK Material Wafer Carriers
The four PEEK products launched by ZYPEEK this time are ideal choices for wafer carriers.
ZYPEEK has developed this product specifically for the application scenario of wafer carriers.
Since the launch of the first generation wafer carrier product in 2021, the company's R&D team has continuously focused on technological innovation, with significant results.
Currently, ZYPEEK's specialized products for wafer carriers include four grades: 310WA251, 310WA252, 310WA253, and 310WA254.
They all exhibit excellent performance in terms of antistatic properties, ease of processing, and appearance.
The current specialized products for wafer carriers have a surface resistivity of 106-109. The antistatic level can also be customized to meet customer requirements.
The products have passed tests for restricted substances (such as RoHS, REACH, etc.), and also passed metal ion and surface anion/cation tests.
In terms of processing performance, the specialized materials for wafer carriers inherit the easy processing characteristics of ZYPEEK's PEEK products and perform equally well. They are suitable for injection molding processing of wafer carriers.
The size of the wafer is fixed, and the production line is highly automated. When wafers need to be loaded into wafer carriers, the dimensions of the internal tooth sections of the wafer carrier must be stable. Even slight deviations can result in damaged wafers. This stability must be maintained even after high and low-temperature cycling.
Therefore, the dimensional stability of wafer carriers is crucial.
The appearance of the wafer carrier is smooth and flat, with no obvious patterns or flow marks.
Our wafer carrier products use the "solution-grinding-high-speed" dispersion process:
Solution dispersion allows additives to uniformly adhere to the PEEK surface, enhancing the surface activity of PEEK;
Grinding dispersion ensures that the conductive agent tightly adheres to PEEK, making the product's electrical performance more stable;
Finally, high-speed dispersion ensures uniform dispersion of the filler and components, guaranteeing product quality stability and consistency.
The following are introductions to four specialized PEEK wafer carrier products. For detailed parameter information, please feel free to contact us.
Application: Mainly used for the first-generation wafer carriers, already in stable mass production.
Surface Resistivity: 104-106.
Application: An innovative product for the new generation of wafer carriers, representing the latest antistatic products on the market. It has passed the customer validation phase and is currently the main recommended model.
Surface Resistivity: Stable at 106-109 .
Customization: Surface resistivity can be adjusted according to customer needs, providing customized services.
Customer-specific customization
Surface Resistivity: 105-109, suitable for a wider range of applications.
Appearance: The product appearance is bright and, after processing, the wafer carriers are smooth and flat with no obvious patterns or flow marks.
ZYPEEK has an efficient R&D and testing team, able to quickly respond to customer needs. New formulas can be launched within as fast as half a month, providing customized solutions.
The testing team provides comprehensive data analysis services to ensure product performance meets customer standards.
The company's antistatic PEEK modification technology has been industrialized and received positive feedback from the market.
With simulation conditions and wafer carrier molds, new products can be directly injection molded for internal testing. Customers can directly evaluate injection molded products, reducing the frequency of mold trials, increasing testing speed, and lowering testing costs.
ZYPEEK continues to adhere to quality and innovation, deepening exploration in the field of PEEK resin, committed to enhancing material performance and optimizing costs, empowering industry upgrades.
With market demand as the helm and technological breakthroughs as the sail, we lead the domestic PEEK industry forward towards a smarter and more sustainable future for different industries and fields.
For further information on our products or to request samples, please feel free to contact us.
+86-(0431)-89625588
