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770PF-200

770PF-200

770PF-200

Unfilled Fine Power

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Compression Molding Grain Diameter(D50)74

770PF-200 is ground from coarse powder, 200 mesh, particle size 74μm. It is commonly used as raw material for PEEK compression molding with standard flowability. 770PF can also be filled with other inorganic fillers.

Heat-resistant

Corrosion Resistance

Flame Retardance

Low smoke emission

Wear resistance

Wave-Transparence

Toughness

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Properties Table Application Areas Certification Related Resources

Properties Table

TEST	TEST STD	Conditions/Method	Unit	Results
Mechanical Property
Tensile Strength	IS0 527	Break, 23°C	MPa
		Yield, 23°C	MPa
Tensile Elongation	IS0 527	Break, 23°C	%
Flexural Strength	IS0 178	Break, 23°C	MPa
		Yield, 23°C	MPa

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Industry Applications

Automotive & Transportation

High-Performance Polymers
for Next-Generation Transportation

Aerospace

Lighten the Mass, Strengthen the Mission, Expand the boundaries

Electronics &semiconductor

Enabling the precision of digital future with innovative materials

Industrial

Engineered to Outlast the Machine and remold the efficiency

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